View SML-D13DW_9008957.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

sml-d13x(c) series data sheet features outline ?ori g inal device technolo g y enables hi g h bri g htness and hi g h reliability ? aec-q101 qualified size dimensions recommended solder pattern speci?cations typ. i f max. v r min.* 2 typ. max.* 2 i f min. typ. i f (v) (ma) ( a) (v) (nm) (nm) (nm) (ma) (mcd) (mcd) (ma) 627 630 634 35.5 55 616 620 624 56 85 602 605 608 120 584 587 591 110 568 571 574 28 45 563 564.5 566 18 22 20 20 71 75 81 -40 ? +100 2.0 sml-d13vw(c) sml-d13uw(c) SML-D13DW(c) sml-d13ww(c) sml-d13mw(c) sml-d13fw(c) 72 75 algainp yellow 30 100* 1 5 -40 ? +85 -40 ? +100 2.1 20 10 5 p d (mw) i f (ma) part no. chip structure absolute maximum ratings (ta=25oc) electrical and optical characteristics (ta=25oc) power forward peak forward forward voltage v f reverse current i r dominant wavelength d luminous intensity i v dissipation t opr (oc) t stg (oc) emitting color reverse operating temp. storage temp. *1:duty1/10, 1khz *2:measurement tolerance 1nm i fp (ma) v r (v) current current voltage red orange yellowish green green tolerance : 0.1 (unit : mm) (unit : mm) 1608 (0603) 1.6 0.8mm (t=0.55mm) color type v w f m u d 1.6 1.2 0.8 0.65 0.8 0.55 0.18 cathode index 1.5 0.5 r0.275 r0.15 electrode 0.8 0.85 0.8 0.8 pcb bonding direction ??????????????????????????????????????????????????????? www.rohm.com ?2016 rohm co., ltd. all rights reserved 1/9 2017.8 - rev.005
[data sheet] electrical characteristics curves fi g .1 forward current fi g .2 luminous intensit y - - forward volta g es atmos p here tem p erature fi g .3 luminous intensit y - forward current fi g .4 deratin g reference [sml-d13x(c) series] 0 10 20 30 40 -40-200 20406080100 0.0 0.5 1.0 1.5 0 5 10 15 20 25 30 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 -40-20 0 20406080100 1 10 100 1.4 1.6 1.8 2.0 2.2 2.4 ta=25oc forward current : i f [ma] forward voltage : v f [v] i f =20ma relative luminous intensity [a.u.] atmosphere temperature : ta [oc] ta=25oc relative luminous intensity forward current : i f [ma] maximum forward current : [ma] ambient temperature : ta [oc] sml-d13vw(c) sml-d13uw(c) SML-D13DW(c) sml-d13ww(c) sml-d13mw(c) sml-d13fw(c) sml-d13vw(c) sml-d13uw(c) SML-D13DW(c) sml-d13ww(c) sml-d13mw(c) sml-d13fw(c) sml-d13vw(c) sml-d13uw(c) SML-D13DW(c) sml-d13ww(c) sml-d13mw(c) sml-d13fw(c) sml-d13vw(c) sml-d13uw(c) SML-D13DW(c) sml-d13ww(c) sml-d13mw(c) sml-d13fw(c) ??????????????????????????????????????????????????????? www.rohm.com ?2016 rohm co., ltd. all rights reserved 2/9 2017.8 - rev.005
[data sheet] viewin g an g le [sml-d13x(c) series] reference sml-d13vw(c) sml-d13uw(c) SML-D13DW(c) sml-d13ww(c) sml-d13mw(c) sml-d13fw(c) scanning angle (deg) scanning angle (deg) relative intensity (%) relative intensity (%) 0 50 100 90 80 70 60 50 40 30 20 10 0 10 20 30 40 50 60 70 80 90 100 50 x - y ???? (scanning direction) x y 0 50 100 90 80 70 60 50 40 30 20 10 0 10 20 30 40 50 60 70 80 90 100 50 x' - y' ???? (scanning direction) x' y' ??????????????????????????????????????????????????????? www.rohm.com ?2016 rohm co., ltd. all rights reserved 3/9 2017.8 - rev.005
[data sheet] rank reference of bri g htness* *measurement tolerance:10% [sml-d13x(c) series] red(v, u) (ta=25oc, i f 20ma) rank ad ae af ag ah aj ak al am an ap a q ar as at au iv ( mcd ) 4.5? 5.6 5.6?7.1 7.1? 9 9?11.2 11.2 ?14 14?18 18?22.4 22.4? 28 28?35.5 35.5?45 45?56 56? 71 71?90 90?112 112?140 140?180 sml-d13vw(c) sml-d13uw(c) orange(d) (ta=25oc, i f 20ma) rank ad ae af ag ah aj ak al am an ap a q ar as at au iv ( mcd ) 4.5? 5.6 5.6?7.1 7.1? 9 9?11.2 11.2 ?14 14?18 18?22.4 22.4? 28 28?35.5 35.5?45 45?56 56? 71 71?90 90?112 112?140 140?180 SML-D13DW(c) yellow(w) (ta=25oc, i f 20ma) rank ad ae af ag ah aj ak al am an ap a q ar as at au iv ( mcd ) 4.5? 5.6 5.6?7.1 7.1? 9 9?11.2 11.2 ?14 14?18 18?22.4 22.4? 28 28?35.5 35.5?45 45?56 56? 71 71?90 90?112 112?140 140?180 sml-d13ww(c) yellowish green(m) (ta=25oc, i f 20ma) rank ad ae af ag ah aj ak al am an ap a q ar as at au iv ( mcd ) 4.5? 5.6 5.6?7.1 7.1? 9 9?11.2 11.2 ?14 14?18 18?22.4 22.4? 28 28?35.5 35.5?45 45?56 56? 71 71?90 90?112 112?140 140?180 sml-d13mw(c) green(f) (ta=25oc, i f 20ma) rank k2 l1 l2 m1 m2 n1 n2 p1 p2 q 1 q 2r1r2s1s2t1 iv ( mcd ) 4.5?5.6 5.6?7.1 7.1?9 9?11 11?14 14?18 18?22 22?28 28?36 36?45 45?56 56?71 71?90 90?110 110?140 140?180 sml-d13fw(c) ??????????????????????????????????????????????????????? www.rohm.com ?2016 rohm co., ltd. all rights reserved 4/9 2017.8 - rev.005
[data sheet] tapin g (t86) unit: note)tolerance is within 0.2mm unless otherwise specified. part no. construction packin g speci?cation rohm led products are being shipped with desiccant (silica gel) included in moisture-proof bags. or enclosing the humidity indication card inside the bag is ava ilable upon request. please contact the nearest sales office or distributer if neces sary. [sml-d13x(c) series] pasting the moisture sensitive label on the outer surface of th e moisture-proof bags 8.0 1.75 3.5 5.5 00.5 1 2 1.9 180 60 13 0.1 0.05 1.5 0.1 0.1 +1 0 -3 0 0.05 0 0.73 4 packing quantity 3,000pcs/reel pull direction 11.4 1 +0.1 -0.07 +0.1 -0.07 0.1 0.2 0.05 *"-"will be taken out for emitting color special code will be ap plied for chromaticity rank rank sign wb/b/e series. emitting color wb/b/e series. (for white led (brig htness rank)* series name package type chip type emitting color resin color taping specification sml p1 0 vt e1 1 uw d1 2 u2 b h1 3 d m1 4 y3 01 5 y2 notices1 series81 seires z1/zn 6 y a1 7 w 81/82 8 m2 k1 m *concerning the brightness rank. s1 f *please refer to the rank chart above for p2 p luminous intensity classification. 52 e *part name is individual for each rank. p34 b *when shipped as sample,the part name will p36 wb be a representative part name. vn t general products are free of ranks. rgb please contact sales if rank appointment scm 01 is needed. p standard type 1 smld 6a 3v wt8 chip led 1.0x0.6 t=0.2mm 1.6x0.8 t=0.36mm red 1.6x1.15 t=0.55mm t68 cathode at sprocket hole side(the top) t86 ultra high brightness type 3.0x2.0 t=1.3mm 3.5x2.8 t=1.9mm yellowish green yellow 3.4x1.25 t=1.1mm 2.0x1.25 t=0.8mm yellow yellow yellow orange 3 3.2x1.6 t=1.85mm green 1.0x1.0 t=0.2mm green 4.5x2.0 t=0.6mm yellowish green 1.0x1.0 t=0.2mm blue 1.5x1.0 t=0.2mm white 1.3x1.5 t=0.6mm green 3.0x1.5 t=2.2mm 3.5x2.8 t=0.6mm phototransistors chip led csthode at sprocket hole side red/green/blue cathode at sprocket hole side(the back) transparent colorless t86 cathode at sprocket hole side(the top) 1.6x0.8 t=0.55mm low current type red milkey white t87 1 black anode at sprocket hole side(the top) high brightness type for white led, red ??????????????????????????????????????????????????????? www.rohm.com ?2016 rohm co., ltd. all rights reserved 5/9 2017.8 - rev.005
[data sheet] stora g e if the p roduct is heated durin g the reflow under the condition of h yg rosco p ic state, it ma y va p orize and ex p and which will influence the p erformance of the p roduct. therefore, the p acka g e is water p roof. please use the p roduct followin g the conditions: ?usin g conditions ?bakin g bake the p roduct in case of below: the ex p iration date is p assed. the color of indicator ( silica g el ) turned from blue to colorless or from g reen to p ink. ?bakin g conditions a pp lication methods precaution for drive s y stem and o? mode desi g n the circuit without the electric load exceedin g the absolute maximum rating that p lease do not a pp l y volta g e neither forward nor reverse. es p eciall y , for the p roducts with the a g - p aste used in the die bondin g , there?s hi g h p ossibilit y to cause electro mi g ration and result deratin g the deratin g characteristics are based on th e lifetime of luminous intensit y and assum p tion of de g radation & color chan g e of sealin g resin or reflector. about its reliabilit y , o p eration life s p an there?s p ossibilit y for intensit y of li g ht dro p accordin g to workin g conditions and environments ( a pp lied current, surroundin g tem p erature and humidit y , corrosive g ases ) , p lease call our sales lon g time intensit y of li g ht life on mode all the time a pp lied stress on product no resin hardenin g a g ent such as filler is used in the sealin g resin of the p roduct. therefore, p lease p a y attention to the overstress on it which ma y influence its reliabilit y . usa g e the product is led. we are n ot responsible for the usa g e as the diode such as protection chip, precaution (surface mount device) please storin g in the airti g ht container temperature time humidity ?bake products in reel. ?reel and embossed tape are eas y to be deformed when bakin g , rectifier, switchin g and so on. (even if the product is wi thin the expiration date.) 603 12?24h below 20%rh remark so please try not t o apply stress on it. ?recommend bake once. applies on the products. if drive by constant volta g e, it may cause current deviation of the led and result in deviation of luminous intensity, so we recommend to d rive by constant current. (deviation of vf value will caus e deviation of current in led. ) furthermore, for off mode, after opening package 5?30 below 70%rh [sml-d13x(c) series] within 168h with our desiccant (silica g el) in function failure. please evaluate its usin g conditions and environment and use it after confirmed there is no problem . staffs for inquiries about the concerned application below. classification temperature humidity expiration date remar k before using 5?30 30?70%rh within 1 year from receiving storage with waterproof package ??????????????????????????????????????????????????????? www.rohm.com ?2016 rohm co., ltd. all rights reserved 6/9 2017.8 - rev.005
[data sheet] others surroundin g gas notice that if it is stored under the condition of acid g as ( chlorine g as, sulfured g as ) or alkali g as ( ammonia ) , it ma y result in low solderin g abilit y ( caused b y the chan g e in q ualit y of the p latin g surface ) or o p tical characteristics chan g es ( li g ht intensit y , chrominance ) and chan g e in q ualit y of cause die bondin g ( a g - p aste ) materials. all of the abo ve will function failure of therefore, please pay attention to the stora g e environment for mounted product (concern the electrostatic dama g e the p roduct is p art of semiconductor and elect rostatic sensitive, there?s hi g h p ossibilit y to be dama g ed b y the electrostatic dischar g e. please take a pp ro p riate measures to avoid the static electricit y from human bod y and earthin g of p roduction e q ui p ment. the resistance value s of electrostatic dischar g e ( actual values ) var y with p roducts, therefore, p lease call our sales staffs for in q uiries. electroma g netic wave a pp lications with stron g electroma g netic wave such as, ih cooker , will influence the reliabilit y of led, therefore please evaluate before usin g it. [sml-d13x(c) series] the products. g enerated g as of the surroundin g parts of the products and t he atmospheric environment). ??????????????????????????????????????????????????????? www.rohm.com ?2016 rohm co., ltd. all rights reserved 7/9 2017.8 - rev.005
[data sheet] stress stren g th accordin g to he mountin g p osition: abcd so p lease p a y attention to the touch on p roduct. we recommend the solderin g p attern that shows on the ri g ht. it will be different accordin g to mountin g situation of circuit board, therefore, p lease concern before desi g nin g . the p roduct has ado p ted the electrode structure that it should solder with back electrode of the p roduct. thus, p lease be informed that the sha p e of electrode p in of solder fillet formation is not g uaranteed. the throu g h hole on electrode surface is for conduction of front and rear electrodes but not for formation of solder ?llet. ?please set appropriate re?ow temperature based on our product usa g e conditions and speci?cation. ?the max for re?owin g is 2 times, please ?nish the second re?ow solderin g and ?ow solderin g with other parts within the usa g e limitation after open t he moistureproof packa g e. ?for our product that has no sol der resist, because of its sold er amount and solderin g conditions, ?compare with n2 re?ow, durin g air re?ow, because of the heat and surroundin g conditions, it may cause the discoloration of the resin. [sml-d13x(c) series] mountin g . solderin g ?no resin hardenin g a g ent such as ?ller is used in the sealin g resin of the product. therefore, resin expansion and moisture absorpti on at humidity will cause heat stress durin g solderin g process and finally has bad influence o n the product?s reliability. ?the product is not g uaranteed for ?ow solderin g . ?thermal stress durin g the ?ow solderin g of surroundin g parts will in?uence the reliability of led and please evaluate the solderin g conditions before usin g it. also please make su re the expiration date one of its speci?c characterist ics is that solder will penetra te into led. thus, there's hi g h possibility that will influence its reliabilit y.therefore, please be inform ed, concernin g it before usin g it. . automatic mountin g the stress like bendin g stress of circuit board dividin g after mountin g , may cause led packa g e crack or dama g e of led internal j unction, therefore, please concern the mountin g direction and position to avoid bendin g or screwin g with g reat stress of the circuit board. D. mechanical stress after mountin g the mechanical stress may dama g e the led after circuit mountin g , solderin g pattern for recommendation to prevent electrostatic char g e. . mountin g location --. silicon resin sealin g product the sealin g resin of led is very soft, so p lease select adsorption nozzle that would not apply stress directly on the sealin g section. --. mini packa g e (smaller than 1608 size) ?vibration may result in low mountin g rate since it will cause the stat ic electricity of product and adhere to top cover t ape. therefore, the ma g net should be set on p arts feeder cassette of the mounter to control the prod uct stabilization. in addition, it is recommended to set ionizer after openin g the moistureproof packa g e. 0.8mm 0.85mm 0.8mm 0.8mm pcb bonding direction ??????????????????????????????????????????????????????? www.rohm.com ?2016 rohm co., ltd. all rights reserved 8/9 2017.8 - rev.005
[data sheet] solvent we recommend to use alcoho ls solvent such as, isopropyl alcohols cleanin g after solderin g please follow the conditions below if the cleanin g is necessary after solderin g . led products do not contain rein forcement material such as a g lass fillers. recommended condition so thermal stress by solderin g g reatly influence its reliability. please keep followin g points for manual solderin g . condition ) temp. of iron top less than 400 within 3 sec. heatin g on pcb pattern, not direct to the led. (fi g -1) item a) heating method furnaces vary by custom er?s own conditions. attention points in solderin g operation this product was developed as a surface mount led especially su itable for reflow solderin g . so reflow solderin g is recommended. in case of implementin g manual solderin g , please take care of followin g points. solder used sn-cusn-a g -cusn-a g -bi-cu hand soldering condition within 10sec. t r / t temperature rising rate under 3/sec. t d / t temperature decreasing rate over -3/sec. above conditions are for refere nce. therefore, evaluate by cus tomer?s own circuit boards and reflow furnaces before usin g , because stress from circuit boards and temperature variations of reflow t p time for peak temperature [sml-d13x(c) series] re?ow pro?le for re?ow pro?le, please refer to the conditions below:() meanin g of marks, conditions mar k meanings conditions ts max maximum of pre-heating temperature 180 ts min minimum of pre-heating temperature 140 ultrasonic cleanin g 15wbelow 1 liter (capacity of tank) dryin g under 100 within 3 minutes temperature under 30 within 3 minutes t s time from tsmin to tsmax over 60sec. t l reference temperature 230?260 b) handlin g after soldering please handle after the part temp. g oes down to room temp. t l retention time for tl within 40sec. t p peak temperature 260(max) fig \ 1 soldering land soldering iron ??????????????????????????????????????????????????????? www.rohm.com ?2016 rohm co., ltd. all rights reserved 9/9 2017.8 - rev.005
r1102 b www.rohm.com ? 2014 rohm co., ltd. all rights reserved. notice rohm customer support system http://www.rohm.com/contact/ thank you for your accessing to rohm product informations. more detail product informations and catalogs are available, please contact us. notes the information contained herein is subject to change without notice. before you use our products, please contact our sales representative and verify the latest specifica- tions : although rohm is continuously working to improve product reliability and quality, semicon- ductors can break down and malfunction due to various factors. therefore, in order to prevent personal injury or fire arising from failure, please take safety measures such as complying with the derating characteristics, implementing redundant and fire prevention designs, and utilizing backups and fail-safe procedures. rohm shall have no responsibility for any damages arising out of the use of our poducts beyond the rating specified by rohm. examples of application circuits, circuit constants and any other information contained herein are provided only to illustrate the standard usage and operations of the products. the peripheral conditions must be taken into account when designing circuits for mass production. the technical information specified herein is intended only to show the typical functions of and examples of application circuits for the products. rohm does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by rohm or any other parties. rohm shall have no responsibility whatsoever for any dispute arising out of the use of such technical information. the products specified in this document are not designed to be radiation tolerant. for use of our products in applications requiring a high degree of reliability (as exemplified below), please contact and consult with a rohm representative : transportation equipment (i.e. cars, ships, trains), primary communication equipment, traffic lights, fire/crime prevention, safety equipment, medical systems, servers, solar cells, and power transmission systems. do not use our products in applications requiring extremely high reliability, such as aerospace equipment, nuclear power control systems, and submarine repeaters. rohm shall have no responsibility for any damages or injury arising from non-compliance with the recommended usage conditions and specifications contained herein. rohm has used reasonable care to ensur the accuracy of the information contained in this document. however, rohm does not warrants that such information is error-free, and rohm shall have no responsibility for any damages arising from any inaccuracy or misprint of such information. please use the products in accordance with any applicable environmental laws and regulations, such as the rohs directive. for more details, including rohs compatibility, please contact a rohm sales office. rohm shall have no responsibility for any damages or losses resulting non-compliance with any applicable laws or regulations. when providing our products and technologies contained in this document to other countries, you must abide by the procedures and provisions stipulated in all applicable export laws and regulations, including without limitation the us export administration regulations and the foreign exchange and foreign trade act. this document, in part or in whole, may not be reprinted or reproduced without prior consent of rohm. 1) 2) 3) 4) 5) 6) 7) 8) 9) 10) 11) 12) 13)
datasheet part number SML-D13DW(c) package sml-d13 automotive unit quantity 3000 minimum package quantity 3000 packing type taping constitution materials list inquiry rohs yes SML-D13DW(c) - web page

▲Up To Search▲

Price & Availability of SML-D13DW

	To Download SML-D13DW Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .